DARPA Selects BAE Systems to Lead Development of Dual RF Processing Microchips

The US Defense Advanced Research Projects Agency (DARPA) has selected BAE Systems to lead development on an advanced communication project integrating analogue and digital radio frequency (RF) capabilities into a single wafer. The USD8 million DARPA contract to BAE Systems’ FAST Labs will cover design and development of a single “wafer-scale...

The US Defense Advanced Research Projects Agency (DARPA) has selected BAE Systems to lead development on an advanced communication project integrating analogue and digital radio frequency (RF) capabilities into a single wafer.

The USD8 million DARPA contract to BAE Systems’ FAST Labs will cover design and development of a single “wafer-scale technology on a silicon foundry platform” that can host mixed-mode technologies across the RF spectrum under the agency’s Technologies for Mixed mode Ultra Scaled Integrated Circuits (T-MUSIC) programme, a BAE Systems’ fact sheet said.

“What we are generally talking about is orders of magnitude higher than any other targeted commercial technology out there right now,” said Chris Rappa, product line director for Radio Frequency, Electronic Warfare, and Advanced Electronics at BAE Systems’ FAST Labs, of BAE Systems’ work on the T-MUSIC programme.

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